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Cover of Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies

Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies

(Hardback)

John Lau,

McGraw-Hill Education - Europe (Publisher)

Published
1996
Reviews
0
Technology, Engineering, Agriculture, Industrial processesElectronics and communications engineeringElectronics engineeringElectronics: circuits and components

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Dealing with BGA, CSP, flip chips and other new technologies that underlie the electronics industry's need for smaller, faster products, this text explains the fundamentals of solder joint reliability and presents creative, robust packaging techniques for cost-effective interconnection.

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