John Lau

Books by Author

Basics Fashion Design 09: Designing Accessories

John Lau

₹3550.0₹2627.0

Semiconductor Advanced Packaging

John H. Lau

₹13679.0₹8618.0

Semiconductor Advanced Packaging

John H. Lau

₹18239.0₹11491.0

Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration

John Lau

₹20519.0₹12927.0

Chiplet Design and Heterogeneous Integration Packaging

John H. Lau

₹14819.0₹9336.0

Solder Joint Reliability

John H. Lau

₹22799.0₹14363.0

Chiplet Design and Heterogeneous Integration Packaging

John H. Lau

₹20519.0₹12927.0

Fan-Out Wafer-Level Packaging

John H. Lau

₹17099.0₹10772.0

Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology

John H. Lau

₹19379.0₹12209.0

Heterogeneous Integrations

John H. Lau

₹18239.0₹11491.0

Mindfulness for Child and Adolescent Well-Being

John Chi-Kin Lee

₹6227.0₹3798.0

Classical Chinese Literature: An Anthology of Translations

Joseph S. M. Lau

₹4900.0₹3430.0

Mindfulness for Child and Adolescent Well-Being

John Chi-Kin Lee

₹22789.0₹13901.0

Assembly and Reliability of Lead-Free Solder Joints

John H. Lau

₹13109.0₹8259.0

Assembly and Reliability of Lead-Free Solder Joints

John H. Lau

₹18239.0₹11491.0

Thermal Stress and Strain in Microelectronics Packaging

John Lau

₹17099.0₹10772.0

Through-Silicon Vias for 3D Integration

John Lau

₹7458.0

Advanced MEMS Packaging

John Lau

₹8239.0

Reliability of RoHS-Compliant 2D and 3D IC Interconnects

John Lau

₹6723.0

Fan-Out Wafer-Level Packaging

John H. Lau

₹12539.0₹7900.0

Solder Joint Reliability

John H. Lau

₹22799.0₹14363.0

Handbook Of Tape Automated Bonding

John H. Lau

₹22799.0₹14363.0

Chip On Board

John H. Lau

₹22799.0₹14363.0

Husserl’s Logical Investigations in the New Century: Western and Chinese Perspectives

John J. Drummond

₹11399.0₹7181.0

Husserl’s Logical Investigations in the New Century: Western and Chinese Perspectives

John J. Drummond

₹11399.0₹7181.0

Ultra-high Frequency Linear Fiber Optic Systems

John Park

₹1954.0

Microvias: For Low Cost, High Density Interconnects

Ricky Lee

₹2284.0

Mechanics of Solder Alloy Interconnects

Darrel R. Frear

₹22799.0₹14363.0

Cu-Interconnects, Glass, and AI-Assisted Simulation for Chiplets and Heterogeneous Integration

John Lau

₹23669.0₹22249.0

Nihil

John Lau

₹4365.0₹2925.0