Lets Explore,

Cover of Chip On Board: Technology for Multichip Modules(E; Ectrical Engineering)

Chip On Board: Technology for Multichip Modules(E; Ectrical Engineering)

(Hardback)

John H. Lau,

Van Nostrand Reinhold Inc.,U.S. (Publisher)

Published

1994

Reviews

0

Technology, Engineering, Agriculture, Industrial processes Electronics and communications engineering Electronics engineering Electronics: circuits and components

By: John H. Lau | Publisher: Van Nostrand Reinhold Inc.,U.S. | Released: 30 Jun 1994

Ships within 12-14 days

₹13376.00

₹21231.00

37% off

1

This book is a one-stop guide to the state of the art of COB technology. For professionals active in COB and MCM research and development, those who wish to master COB and MCM problem-solving methods, and those who must choose a cost-effective design and high-yield manufacturing process for their interconnect systems, here is a timely summary of progress in al aspects of this fascinating field.
It meets the reference needs of design, material, process, equipment, manufacturing, quality, reliability, packaging, and system engineers, and technical managers working in electronic packaging and interconnection.

More books by John H. Lau

Cover of Semiconductor Advanced Packaging

Semiconductor Advanced Packaging

John H. Lau

₹13679.0₹8618.0

Cover of Semiconductor Advanced Packaging

Semiconductor Advanced Packaging

John H. Lau

₹18239.0₹11491.0

Cover of Chiplet Design and Heterogeneous Integration Packaging

Chiplet Design and Heterogeneous Integration Packaging

John H. Lau

₹14819.0₹9336.0

Cover of Solder Joint Reliability

Solder Joint Reliability

John H. Lau

₹22799.0₹14363.0

Cover of Chiplet Design and Heterogeneous Integration Packaging

Chiplet Design and Heterogeneous Integration Packaging

John H. Lau

₹20519.0₹12927.0

Cover of Fan-Out Wafer-Level Packaging

Fan-Out Wafer-Level Packaging

John H. Lau

₹17099.0₹10772.0

Cover of Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology

Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology

John H. Lau

₹19379.0₹12209.0

Cover of Heterogeneous Integrations

Heterogeneous Integrations

John H. Lau

₹18239.0₹11491.0

Cover of Assembly and Reliability of Lead-Free Solder Joints

Assembly and Reliability of Lead-Free Solder Joints

John H. Lau

₹13109.0₹8259.0

Cover of Assembly and Reliability of Lead-Free Solder Joints

Assembly and Reliability of Lead-Free Solder Joints

John H. Lau

₹18239.0₹11491.0

Cover of Fan-Out Wafer-Level Packaging

Fan-Out Wafer-Level Packaging

John H. Lau

₹12539.0₹7900.0

Cover of Solder Joint Reliability

Solder Joint Reliability

John H. Lau

₹22799.0₹14363.0

Cover of Handbook Of Tape Automated Bonding

Handbook Of Tape Automated Bonding

John H. Lau

₹22799.0₹14363.0

Cover of Chip On Board

Chip On Board

John H. Lau

₹22799.0₹14363.0

Cover of Mechanics of Solder Alloy Interconnects

Mechanics of Solder Alloy Interconnects

Darrel R. Frear

₹22799.0₹14363.0

Cover of Chip Scale Package, CSP

Chip Scale Package, CSP

John H Lau

Cover of Microvias: For Low Cost, High Density Interconnects

Microvias: For Low Cost, High Density Interconnects

John H Lau

Cover of Microvias: For Low Cost, High Density Interconnects

Microvias: For Low Cost, High Density Interconnects

John H Lau

Cover of Low Cost Flip Chip Technologies for Dca, Wlcsp, and Pbga Assemblies

Low Cost Flip Chip Technologies for Dca, Wlcsp, and Pbga Assemblies

John H Lau

Cover of Chip Scale Package, CSP

Chip Scale Package, CSP

John H Lau

Cover of Reliability of Rohs-Compliant 2D and 3D IC Interconnects

Reliability of Rohs-Compliant 2D and 3D IC Interconnects

John H Lau

Cover of Thermal Stress and Strain in Microelectronics Packaging

Thermal Stress and Strain in Microelectronics Packaging

John H. Lau

Cover of Through-Silicon Vias for 3D Integration

Through-Silicon Vias for 3D Integration

John H Lau

Cover of The Handbook of Fine Pitch Surface Mount Technology

The Handbook of Fine Pitch Surface Mount Technology

John H. Lau

Cover of 3D IC Integration and Packaging

3D IC Integration and Packaging

John H Lau

Cover of Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies

Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies

John H. Lau

Cover of Reliability of Rohs-Compliant 2D and 3D IC Interconnects

Reliability of Rohs-Compliant 2D and 3D IC Interconnects

John H Lau

Cover of Microvias

Microvias

John H Lau

Cover of Microvias: For Low Cost, High Density Interconnects

Microvias: For Low Cost, High Density Interconnects

John H Lau

Cover of Solder Joint Reliability

Solder Joint Reliability

John H Lau

Similar Products

Cover of Flip Chip Technologies

Flip Chip Technologies

John Lau

Cover of Chip Scale Package, CSP

Chip Scale Package, CSP

John H Lau

Cover of Chip Scale Package, CSP

Chip Scale Package, CSP

John H Lau

Cover of Low Cost Flip Chip Technologies for Dca, Wlcsp, and Pbga Assemblies

Low Cost Flip Chip Technologies for Dca, Wlcsp, and Pbga Assemblies

John H Lau

Cover of Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies

Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies

John H. Lau

Cover of Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology

Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology

John H. Lau

₹19379.0₹12209.0

Cover of Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies

Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies

John Lau

Cover of Chip-On-Chip

Chip-On-Chip

John McBrewster

Vidya AI