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Cover of Signal Processing, Telecommunication and Embedded Systems with AI and ML Applications: Proceedings of 8th International Conference on Microelectronics Electromagnetics and Telecommunications (ICMEET 2023)(1281 Lecture Notes in Electrical Engineering)

Signal Processing, Telecommunication and Embedded Systems with AI and ML Applications: Proceedings of 8th International Conference on Microelectronics Electromagnetics and Telecommunications (ICMEET 2023)(1281 Lecture Notes in Electrical Engineering)

(Hardback)

Vikrant Bhateja, Jaume Anguera, Anumoy Ghosh, Wendy Flores Fuentes, V. V. S. S. S Chakravarthy,

Springer Verlag, Singapore (Publisher)

Published
2024
Reviews
0
Technology, Engineering, Agriculture, Industrial processesElectronics and communications engineeringElectronics engineeringElectronics: circuits and components

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The book discusses the latest developments and outlines future trends in the fields of microelectronics, electromagnetics, and telecommunication. It contains original research works presented at the International Conference on Microelectronics, Electromagnetics and Telecommunication (ICMEET 2023), organized by Department of Electronics and Communication Engineering, National Institute of Technology Mizoram, India during 6 – 7 October 2023. The book is divided into two volumes, and it covers papers written by scientists, research scholars and practitioners from leading universities, engineering colleges and R&D institutes from all over the world and share the latest breakthroughs in and promising solutions to the most important issues facing today’s society.

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